I’m of the opinion that this is why liquid cooling is so important to next gen hw. I think they’re going to start spreading out the chips more and sandwiching them like with the dh200s Nvidia is working on
Absolutely. 3D stacking is becoming viable too, as AMD has proven with their X3D chips with massive gobs of L3 cache stacked on top of the logic dies. Vertical stacking and sheer die size is going to make total power density only continue to go up.
I’m of the opinion that this is why liquid cooling is so important to next gen hw. I think they’re going to start spreading out the chips more and sandwiching them like with the dh200s Nvidia is working on
Absolutely. 3D stacking is becoming viable too, as AMD has proven with their X3D chips with massive gobs of L3 cache stacked on top of the logic dies. Vertical stacking and sheer die size is going to make total power density only continue to go up.